LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

PROBLEM TO BE SOLVED: To prevent decline of hole quality or hole diameter accuracy caused by fluctuation of a laser beam emission start time.SOLUTION: A laser processing apparatus includes a photodetector 3 for detecting a laser beam emitted from a laser oscillator 1. After a fixed time after a lase...

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Hauptverfasser:	KUDO TAKAHIRO, OSAKA YOSHIHISA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES USING STIMULATED EMISSION ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent decline of hole quality or hole diameter accuracy caused by fluctuation of a laser beam emission start time.SOLUTION: A laser processing apparatus includes a photodetector 3 for detecting a laser beam emitted from a laser oscillator 1. After a fixed time after a laser beam emission detection time by the photodetector 3, a control part 10 controls an acousto-optic modulator 4 so that branch to a direction in which the laser beam from the laser oscillator 1 is used for processing is started. 【課題】レーザビーム出射開始時刻の変動による穴品質や穴径精度の低下を防止することを目的とする。【解決手段】レーザ発振器１から出射されたレーザビームを検出するフォトディテクタ３を備え、当該フォトディテクタ３によるレーザビーム出射検出時点よりも後になる一定時間後に制御部１０は前記レーザ発振器１からのレーザビームを加工に使用する方向への分岐を開始させるよう音響光学変調器４を制御する。【選択図】図２