LIGHT-EMITTING DEVICE

PROBLEM TO BE SOLVED: To simultaneously solve the two problems of minimizing short circuits and improving heat dissipation efficiency in a light-emitting device 100 in which a light-emitting element 10 is to be flip-chip mounted in a bumpless manner using an anisotropic conductive adhesive paste 30...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	UMEZU NORIO, MATSUMURA TAKASHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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