LIGHT-EMITTING DEVICE
PROBLEM TO BE SOLVED: To simultaneously solve the two problems of minimizing short circuits and improving heat dissipation efficiency in a light-emitting device 100 in which a light-emitting element 10 is to be flip-chip mounted in a bumpless manner using an anisotropic conductive adhesive paste 30...
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| Format: | Patent |
| Sprache: | eng ; jpn |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To simultaneously solve the two problems of minimizing short circuits and improving heat dissipation efficiency in a light-emitting device 100 in which a light-emitting element 10 is to be flip-chip mounted in a bumpless manner using an anisotropic conductive adhesive paste 30 onto n-type side and p-type side electrode pads 21, 22 formed on a substrate 20.SOLUTION: In a light-emitting device 100, a light-emitting element 10 is to be flip-chip mounted in a bumpless manner using an anisotropic conductive adhesive paste 30 onto n-type side and p-type side electrode pads 21, 22 formed on a substrate 20. The width of the n-type side and p-type side electrode pads 21, 22 is set to be equal to or narrower than the width of the light-emitting element 10.
【課題】発光素子１０が、基板２０上に形成されたｎ型側、ｐ型側電極パッド２１、２２に異方性導電接着ペースト３０を用いてバンプレスでフリップチップ実装すべき発光装置１００において、短絡の抑制と放熱効率の向上という二つの課題を同時に解決できるようにする。【解決手段】発光素子１０が、基板２０上に形成されたｎ型側、ｐ型側電極パッド２１、２２に異方性導電接着ペースト３０を用いてバンプレスでフリップチップ実装された発光装置１００において、ｎ型側、ｐ型側電極パッド２１、２２の幅を発光素子１０の幅と同等またはそれよりも狭くする。【選択図】図２Ｃ |
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