INLET OF NON-CONTACT IC CARD, MANUFACTURING METHOD THEREOF, AND NON-CONTACT IC CARD

PROBLEM TO BE SOLVED: To provide a novel inlet that can make the inlet transparent, sweep out dust emission from a base sheet, and eliminate restriction on a processing method and restriction on handling at the subsequent stage on the basis of the base sheet being fragile.SOLUTION: An inlet includes...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: DAIKYO KOJI, MATSUMOTO KEIICHI
Format: Patent
Sprache:eng ; jpn
Schlagworte:
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