Fe-P-BASED COPPER ALLOY SHEET EXCELLENT IN STRENGTH, HEAT RESISTANCE AND BENDABILITY

PROBLEM TO BE SOLVED: To provide an Fe-P-based copper alloy sheet having high strength and excellent in heat resistance and oxide film adhesion.SOLUTION: The Fe-P-based copper alloy sheet having high strength and excellent in heat resistance and oxide film adhesion contains Fe:1.6 to 2.6 mass%, P:0.01 to 0.15 mass%, Zn:0.01 to 1.0 mass%, one or more kind of Sn and Mg:0.1 to 0.5 mass%, C:0.003 mass% or less, Co, Si and Cr of 0.05 mass% or less in total and the balance Cu with inevitable impurities and has a weighted average obtained by weighting circle-equivalent diameter of each crystal particle by area of 10 μm or less when a crystal structure of a cross section parallel to a rolling direction and vertical to a sheet surface is observed by EBSD (Electron BackScatter Diffraction), a conductivity of 50% IACS or more, a Vickers hardness of 180 Hv or more and an existing density of deposition particle of Fe or an Fe-P compound having circle-equivalent diameter of 10 to 40 nm of 20/μm2 or more. 【課題】高い強度を有し、耐熱性及び酸化膜密着性に優れたＦｅ−Ｐ系銅合金板を提供する。【解決手段】Ｆｅ：１．６〜２．６質量％、Ｐ：０．０１〜０．１５質量％、Ｚｎ：０．０１〜１．０質量％、Ｓｎ及びＭｇの１種以上：０．１〜０．５質量％、Ｃ：０．００３質量％以下、Ｃｏ、Ｓｉ及びＣｒが合計で０．０５質量％以下、残部Ｃｕ及び不可避不純物からなり、圧延方向に平行で板面に垂直な断面の結晶組織をＥＢＳＤで観察した場合に、各結晶粒の円相当直径を面積で重み付けした加重平均が１０μｍ以下であり、導電率が５０％ＩＡＣＳ以上、ビッカース硬さが１８０Ｈｖ以上、円相当直径が１０〜４０ｎｍのＦｅ又はＦｅ−Ｐ化合物の析出粒子の存在密度が２０個／μｍ２以上である。【選択図】なし