SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device which inhibits the occurrence of a crack in an encapsulation resin.SOLUTION: A semiconductor device comprises: a base plate 1; an insulating substrate 3 mounted on a first principal surface 1a of the base plate 1; a semiconductor chip 4 mounted on a circuit pattern on a surface of the insulating substrate 3; a case 10 which is attached to the first principal surface 1a of the base plate 1 so as to form an internal space with the base plate 1 to cover the semiconductor chip 4 and has an opposing surface 10a opposite to the first principal surface 1a across the internal space; an electrode 6 which extends in the internal space along a direction from the insulating substrate 3 side toward the opposing surface 10a side and has a corner 6D1 along the extension direction; an encapsulation resin 9 for encapsulating the internal space; and ribs 12, 13 attached to the opposing surface 10a of the case 10 in the internal space and opposite to the corner 6D1 of the electrode 6. The ribs 12, 13 are provided in a plane perpendicular to the corner 6D1 to cover a direction at an angle of ±22.5° from a bisector of an angle of the corner 6D1. 【課題】封止樹脂のクラックの発生を抑制する半導体装置を提供する。【解決手段】ベース板１と、ベース板１の第１主面１ａに搭載された絶縁基板３と、絶縁基板３表面の回路パターンに搭載された半導体チップ４と、ベース板１との間で半導体チップ４を覆う内部空間を構成するように、ベース板１の第１主面１ａに取り付けられ、内部空間を挟んで第１主面１ａに対向する対向面１０ａを有するケース１０と、前記内部空間において、絶縁基板３側から対向面１０ａ側に向かう方向に沿って延設され、延設方向に沿った角部６Ｄ１を有する電極６と、内部空間を封止する封止樹脂９と、内部空間において、電極６の角部６Ｄ１に対向してケース１０の対向面１０ａに取り付けられたリブ１２，１３と、を備える。リブ１２，１３は、角部６Ｄ１に垂直な平面において角部６Ｄ１の角の二等分線から?２２．５?の方向を覆って設けられる。【選択図】図６