PUNCHED THIN FILM AND POWER STORAGE DEVICE USING THE SAME

PROBLEM TO BE SOLVED: To provide a punched thin film capable of improving adhesion with a coating material and a power storage device using the same.SOLUTION: A punched thin film 1 includes: a first surface 1a; and a second surface 1b facing the first surface 1a. A through-hole 11 penetrating from t...

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1. Verfasser: TOMONO MASAKI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a punched thin film capable of improving adhesion with a coating material and a power storage device using the same.SOLUTION: A punched thin film 1 includes: a first surface 1a; and a second surface 1b facing the first surface 1a. A through-hole 11 penetrating from the first surface 1a to the second surface 1b is provided. The through-hole 11 has a first region 11a, having an opening in the first surface 1a, expanding from the second surface 1b side toward the first surface 1a and a second region 11b, having an opening in the second surface 1b, expanding from the first surface 1a side toward the second surface 1b. 【課題】塗工物との接着性を向上することが可能な穿孔薄膜及び穿孔薄膜を用いた蓄電装置を提供する。【解決手段】穿孔薄膜1は、第一面1aと、第一面1aに対向する第二面1bとを備え、第一面1aから第二面1bに貫通する貫通孔11が設けられる。貫通孔11は、第一面1aに開口して第二面1b側から第一面1aに向かって広がる第一領域11aと、第二面1bに開口して第一面1a側から第二面1bに向かって広がる第二領域11bとを有する。【選択図】図2