APPARATUS AND METHOD FOR ELECTROCHEMICAL DEPOSITION

PROBLEM TO BE SOLVED: To provide a system in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electro-chemical deposition tool platform.SOLUTION: The smaller flow is diverted to a dosing unit 262 which may be on a separate platform. The...

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Bibliographische Detailangaben
Hauptverfasser:	STEVENS JOSEPH J, CHAO SANDY S, RABINOVICH YEVGENIY, OLGADO DONALD J, D'AMBRA ALLEN L, DENOME MARK R
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a system in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electro-chemical deposition tool platform.SOLUTION: The smaller flow is diverted to a dosing unit 262 which may be on a separate platform. The dosing unit 262 in one embodiment comprises a pressurized flow line. 【課題】電気化学堆積ツール用プラットフォーム上を流れる堆積用液のより大きな流れから堆積用液のより小さな流れを迂回させるシステムを提供する。【解決手段】より小さな流れは迂回して別のプラットフォーム上にあってもよい投与装置２６２へ向かう。一実施例において投与装置２６２は加圧されたフローラインを含む。【選択図】図４