ADHESIVE COATING METHOD AND METHOD FOR MANUFACTURING MOUNTING SUBSTRATE

PROBLEM TO BE SOLVED: To provide an adhesive coating method capable of coating an adhesive on a long substrate with high location accuracy and also causing no deterioration in coating work efficiency.SOLUTION: In an adhesive coating method, a plurality of pad printing machines 10 are used, each pad...

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1. Verfasser: OMURA SHINGO
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an adhesive coating method capable of coating an adhesive on a long substrate with high location accuracy and also causing no deterioration in coating work efficiency.SOLUTION: In an adhesive coating method, a plurality of pad printing machines 10 are used, each pad printing machine including a pad 16 and an intaglio plate holding an adhesive such as a conductive solder paste, an anisotropic conductive resin paste and an insulating resin, and the pad printing machines are disposed, for example, to be different alternately to each other on one end side and the other end side of a long substrate 1 in a width direction thereof along a longitudinal direction thereof to coat the adhesive on the flexible long substrate. 【課題】接着剤を長尺基板に位置精度よく塗布し、かつ、塗布作業効率も低下させない接着剤塗布方法を提供する。【解決手段】接着剤塗布方法は、導電性の半田ペーストや異方性導電樹脂ペースト、絶縁性樹脂等の接着剤を保持する凹版プレートとパッド16とを備えたパッド印刷機10を複数用いて、たとえば長尺基板1の長手方向に沿って幅方向の一端側と他端側とに互い違いに交互に配置して、可撓性を有する長尺基板上に接着剤を塗布する。【選択図】図2