METHOD FOR CUTTING SEMICONDUCTOR SUBSTRATE, METHOD FOR CUTTING SOLAR BATTERY, AND SOLAR BATTERY
PROBLEM TO BE SOLVED: To provide a solar battery which enables the uniform application of force to all of split grooves when dividing a semiconductor substrate; a method for cutting a solar battery; and a method for splitting a semiconductor substrate.SOLUTION: A method for manufacturing a solar bat...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a solar battery which enables the uniform application of force to all of split grooves when dividing a semiconductor substrate; a method for cutting a solar battery; and a method for splitting a semiconductor substrate.SOLUTION: A method for manufacturing a solar battery comprises: the first step of forming a photoelectric conversion part in a crystal semiconductor substrate; the second step of forming split grooves in the crystal semiconductor substrate; and the third step of splitting the crystal semiconductor substrate by folding the crystal semiconductor substrate along the split grooves. In the third step, the crystal semiconductor substrate is fixed between a holder and a press member and then, a cutting blade is moved to fold outer peripheral portions of the crystal semiconductor substrate along the split grooves, whereby the crystal semiconductor substrate is split off. The split grooves are not in parallel with cleavage faces of the crystal semiconductor substrate. The holder of a cutter, the press member and the cutting blade are substantially the same in shape and size as the split grooves in plane view.
【課題】半導体基板を割断する際に、全ての分割溝に均一な力を加える太陽電池及び太陽電池の割断方法並びに半導体基板の割断方法を提供する。【解決手段】結晶半導体基板に光電変換部を形成する第1の工程と、結晶半導体基板に分割溝を形成する第2の工程と、分割溝に沿って結晶半導体基板を折り曲げることにより、結晶半導体基板を割断する第3の工程と、を備え、第3の工程は、結晶半導体基板を載置台とプレス部材との間に固定し、割断刃を移動させて結晶半導体基板の外周部を分割溝に沿って折り曲げて割断する工程であり、分割溝は、結晶半導体基板の劈開面と平行ではなく、割断装置の載置台、プレス部材及び前記割断刃は、平面視において分割溝と略同形状かつ略同寸法である。【選択図】図4 |
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