PACKAGING STRUCTURE OF ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a packaging structure in which high packaging position precision and a sufficient bonding strength are secured while preventing the occurrence of packaging trouble where an electronic component rises during packaging.SOLUTION: A packaging structure 1A includes: an el...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	NAKAGAWA SEISHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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