PACKAGING STRUCTURE OF ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a packaging structure in which high packaging position precision and a sufficient bonding strength are secured while preventing the occurrence of packaging trouble where an electronic component rises during packaging.SOLUTION: A packaging structure 1A includes: an electronic component 10 including external electrodes 15 and 16; a wiring board 20A including lands 25 and 26; and bonding parts 31 and 32 formed from a solder bonding material. The bonding part 31 bonds the external electrode 15 and the land 25, and the bonding part 32 bonds the eternal electrode 16 and the land 26. The external electrodes 15 and 16 include: cover parts 15a and 16a covering a principal surface 11a2 of an element assembly 11 opposing the wiring board 20A; and cover parts 15b and 16b covering end faces 11b1 and 11b2 being positioned oppositely in a length direction L of the element assembly 11, respectively. A distance De between the cover parts 15a and 16a in the length direction L and a distance Dl between the lands 25 and 26 in the length direction L meet a condition of 0.91≤Dl/De≤1.09. 【課題】実装時において電子部品が起立してしまう実装不具合の発生を抑制しつつ、高い実装位置精度および十分な接合強度が確保された実装構造体を提供する。【解決手段】実装構造体１Ａは、外部電極１５，１６を含む電子部品１０と、ランド２５，２６を含む配線基板２０Ａと、半田接合材からなる接合部３１，３２とを備える。接合部３１は、外部電極１５とランド２５とを接合し、接合部３２は、外部電極１６とランド２６とを接合する。外部電極１５，１６は、配線基板２０Ａに対向する素体１１の主面１１ａ２を覆う被覆部１５ａ，１６ａと、素体１１の長さ方向Ｌにおいて相対して位置する端面１１ｂ１，１１ｂ２を覆う被覆部１５ｂ，１６ｂとをそれぞれ含む。上記長さ方向Ｌにおける被覆部１５ａおよび被覆部１６ａ間の距離Ｄｅと、上記長さ方向Ｌにおけるランド２５およびランド２６間の距離Ｄｌとが、０．９１ Ｄｌ／Ｄｅ １．０９の条件を充足する。【選択図】図７