VACUUM PROCESSING APPARATUS

PROBLEM TO BE SOLVED: To provide a technique which allows for sufficient static elimination of an attraction surface in an electrostatic attraction part, without lowering the processing efficiency of deposition, or the like, in a vacuum processing apparatus.SOLUTION: A vacuum processing apparatus includes a first processing chamber 11 performing vacuum processing for a processed substrate W, a vacuum chamber 2 connected with the first processing chamber 11 and having a substrate conveyance region 5 where the processed substrate W is conveyed, and a stage 21 having an electrostatic attraction part 25 for attracting the processed substrate W electrostatically, and configured movably between the first processing chamber 11 of the vacuum chamber 2 and the substrate conveyance region 5. In the substrate conveyance region 5 of the vacuum chamber 2, while retreating the processed substrate W from the electrostatic attraction part 25 of the stage 21, the attraction surface for attracting the processed substrate W in the electrostatic attraction part 25 is subjected to static elimination with ionized inert gas G, and the substrate conveyance region 5 is evacuated. 【課題】真空処理装置において、成膜等の処理効率を低下させることなく、静電吸着部の吸着面の除電を十分に行うことができる技術を提供する。【解決手段】処理対象基板Ｗに対して真空処理を行う第１の処理室１１と、第１の処理室１１に接続され処理対象基板Ｗの搬送を行う基板搬送領域５とを有する真空槽２と、処理対象基板Ｗを静電吸着する静電吸着部２５を有し真空槽２の第１の処理室１１と基板搬送領域５との間を移動可能に構成されたステージ２１とを備える。真空槽２の基板搬送領域５において、処理対象基板Ｗをステージ２１の静電吸着部２５から退避させた状態で、静電吸着部２５の処理対象基板Ｗを吸着する吸着面に対し、イオン化された不活性ガスＧで除電を行い、かつ、基板搬送領域５の真空排気を行うように構成されている。【選択図】 図６