DEVICE FOR PROCESSING SURFACE OF WAFER SHAPE ARTICLE

PROBLEM TO BE SOLVED: To provide a device for preventing the undesirable change in a process parameter due to condensation of process vapor, the damage or breakage of a delicate device structure on the workpiece due to condensed liquid drops, and reduction in throughput .SOLUTION: A device for proce...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	RAINER OBWEGER
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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