COMPONENT MOUNTING DEVICE

PROBLEM TO BE SOLVED: To provide a component mounting device in which, even when the size of a component support member for supporting a film-like potion of a component mounted on a substrate from below is changed, the component support member is prevented from being in contact with other components on the device.SOLUTION: The component mounting device includes: a component mounting operation part 22b for mounting a component 4 having a film-like portion 4a on a substrate 2; a component press-bonding operation part (a first component press-bonding operation part 22c and a second component press-bonding operation part 22d) for press-bonding the component 4 mounted on the substrate 2 by the component mounting operation part 22b on the substrate 2; a substrate placement stage 53 being movable between the component mounting operation part 22b and the component press-bonding operation part; a component support member 54 provided on the substrate placement stage 53, and supporting the film-like portion 4a of the component 4 mounted on the substrate 2 by the component mounting operation part 22b from below; and size detection means (a size detection sensor 64S and a size detection part 24S of a control device 24) for detecting the size of the component support member 54. 【課題】基板に搭載された部品のフィルム状部分を下方から支持する部品支持部材のサイズを変更した場合等においても、部品支持部材が装置上の他の構成要素と接触しないようにすることができる部品実装装置を提供することを目的とする。【解決手段】フィルム状部分を有した部品４を基板２に搭載する部品搭載作業部２２ｂ、部品搭載作業部２２ｂにより基板２に搭載された部品４を基板２に圧着する部品圧着作業部（第１の部品圧着作業部２２ｃ及び第２の部品圧着作業部２２ｄ）、部品搭載作業部２２ｂと部品圧着作業部との間で移動可能な基板載置ステージ５３、基板載置ステージ５３に設けられ、部品搭載作業部２２ｂによって基板２に搭載された部品４のフィルム状部分４ａを下方から支持する部品支持部材５４及び部品支持部材５４のサイズを検出するサイズ検出手段（サイズ検出用センサ６４Ｓ及び制御装置２４のサイズ検出部２４Ｓ）を備える。【選択図】図６