MOLD PACKAGE

PROBLEM TO BE SOLVED: To provide a mold package in which airtightness in a case is hard to be lost even if deformation of a case and a lid accompanied by thermal shrinkage is generated.SOLUTION: Disclosed is a mold package 1 including: an electronic component 32 which is housed in first and second recesses 31b, 31c formed in a case 31; a lid 33; and a joint part 34 for joining the case 31 and the lid 33. In this mold package, a side wall surface 31bb of a first recess 31b and a side surface 33c of the lid 33 are made to be joined by the joint part 34 in parallel to each other, then a bottom surface 31ba of the first recess 31b and the other surface 33b of the lid 33 are made to be joined by the joint part 34 in parallel to each other, and then the side wall surface 31cb of a second recess 31c and a side surface 33da of a protrusion 33d are made to be joined by the joint part 34 in parallel to each other. 【課題】モールド樹脂の熱収縮に伴うケースや蓋の変形が生じてもケース内の気密性が損なわれ難いモールドパッケージを提供する。【解決手段】ケース３１に形成された第１、２凹部３１ｂ、３１ｃ内に収容された電子部品３２と、蓋３３と、ケース３１と蓋３３とを接合する接合部３４とを有するモールドパッケージ１において、以下の構成とする。第１凹部３１ｂの側壁面３１ｂｂと蓋３３の側面３３ｃを、互いに平行して、接合部３４により接合されるようにする。また、第１凹部３１ｂの底面３１ｂａと蓋３３の他面３３ｂを、互いに平行して、接合部３４により接合されるようにする。また、第２凹部３１ｃの側壁面３１ｃｂと凸部３３ｄの側面３３ｄａを、互いに平行して、接合部３４により接合されるようにする。【選択図】図２