LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To prevent an anisotropic conductive adhesive paste 60 from adhering to side surfaces of a light emitting element 10.SOLUTION: A light emitting element 10 is mounted on a mounting substrate 20 while the outer peripheries of a p-type side substrate electrode 31a and an n-type side substrate electrode 31b are prevented from protruding from the outer periphery of a surface on which a p-type side element electrode 11a and an n-type side element electrode 11b are formed among surfaces of an element body 14. A low-floor portion 39 from which the surface of a substrate body 21 is exposed is provided around the p-type side substrate electrode 31a and around the n-type side substrate electrode 31b, and an anisotropic conductive adhesive paste 60 pushed out from between the light emitting element 10, and the p-type side substrate electrode 31a and the n-type side substrate electrode 31b falls to the bottom surface of the low-floor portion 39 and does not adhere to the side surfaces of the light emitting element 10. Consequently, emitted light emitted from the side surfaces of the light emitting element 10 is prevented from being blocked by the anisotropic conductive adhesive paste adhering to the side surfaces. 【課題】異方性導電接着ペースト６０が発光素子１０の側面に付着しないようにする。【解決手段】ｐ型側基板電極３１ａとｎ型側基板電極３１ｂの外周を、素子本体１４の面のうち、ｐ型側素子電極１１ａとｎ型側素子電極１１ｂとが形成された面の外周よりもはみ出ないようにして、発光素子１０を搭載基板２０に搭載する。ｐ型側基板電極３１ａの周囲とｎ型側基板電極３１ｂの周囲には、基板本体２１の表面が露出された低床部分３９が設けられており、発光素子１０とｐ型側基板電極３１ａやｎ型側基板電極３１ｂとの間から押し出された異方性導電接着ペースト６０は、低床部分３９の底面に落下し、発光素子１０の側面に付着しないようになっており、発光素子１０の側面から放出された発光光が、側面に付着した異方性導電接着ペーストによって遮蔽されないようになっている。【選択図】図１Ｂ