CUTTING DEVICE OF RESIN THIN PLATE-SHAPED SUBSTRATE

PROBLEM TO BE SOLVED: To provide a cutting device of a resin thin plate-shaped substrate capable of slowing degradation of cutting properties when cutting a resin separator substrate with a heated blade, by reducing adhesion of resin to the blade, and prolonging the tool life of the blade, while suppressing decrease in quality related to the cut shape, dimensions, and the like, of the separator.SOLUTION: A cutting device has a cutting member 110 including a cutting part 120 provided with a blade 121 for cutting a resin thin plate-shaped substrate 60(separator substrate), and a base 130 where a heating member 131 for heating the blade 121 is arranged, and a heat insulation member 140 for suppressing the transmission of heat generated in the heating member 131 to the thin plate-shaped substrate. The heat insulation member is provided at at least a part of the surface of the cutting member not contributive to the cutting, and in contact with the thin plate-shaped substrate (a portion 121c requiring heat insulation). 【課題】樹脂製のセパレータ基材を加熱した刃で切断した際、刃に固着する樹脂を低減して切断性の悪化を遅らせ、刃の工具寿命を延ばすことができ、かつセパレータの切断形状、寸法などに関わる品質の低下を抑制することが可能な樹脂製薄板状基材の切断装置を提供する。【解決手段】樹脂製の薄板状基材６０（セパレータ基材）を切断する刃１２１が設けられる切断部１２０と、刃１２１を加熱する加熱部材１３１が配置される基部１３０と、を備える切断部材１１０と、加熱部材１３１で生じた熱が薄板状基材に伝わることを抑制する断熱部材１４０と、を有し、断熱部材は、切断部材の表面のうち切断に寄与しない部分であって、かつ薄板状基材に接触する部分（断熱必要部分１２１ｃ）に少なくとも設けられる。【選択図】図３