PLASMA PROCESSING DEVICE

PROBLEM TO BE SOLVED: To provide a plasma processing device capable of suppressing particle generation from a shutter and a shield member.SOLUTION: In a plasma processing device, a conveyance path for carrying-in/out of a workpiece is formed on a sidewall 12a of a processing container. A shield memb...

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Bibliographische Detailangaben
Hauptverfasser:	SHIMIZU IPPEI, MIHARA NAOTERU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a plasma processing device capable of suppressing particle generation from a shutter and a shield member.SOLUTION: In a plasma processing device, a conveyance path for carrying-in/out of a workpiece is formed on a sidewall 12a of a processing container. A shield member is also provided along an inner surface of the sidewall of the processing container. An opening OP facing a conveyance path is formed in the shield member. The shield member includes a Hastelloy contacted surface 62b. The plasma processing device is provided with a shutter 70 for opening and closing the opening of the shield member. The shutter 70 includes a Hastelloy contact part 72. When the shutter 70 closes the opening OP of the shield member, only the contact 72 part comes into contact with the contacted surface 62b. 【課題】シャッター及びシールド部材からパーティクルの発生を抑制可能なプラズマ処理装置の提供。【解決手段】プラズマ処理装置は、処理容器の側壁１２ａに被処理体の搬入出用の搬送路が形成されている。また、処理容器の側壁内面に沿って、シールド部材が設けられている。シールド部材には、搬送路に面する開口ＯＰが形成されている。シールド部材は、ハステロイ製の被接触面６２ｂを有している。プラズマ処理装置には、シールド部材の開口の開閉用のシャッター７０が設けられている。シャッター７０は、ハステロイ製の接触部７２を有している。シャッター７０がシールド部材の開口ＯＰを閉鎖するときには、接触部７２のみが被接触面６２ｂに接する。【選択図】図２