ELECTROLESS PLATING METHOD, AND ELECTROLESS PLATING APPARATUS

PROBLEM TO BE SOLVED: To provide an electroless plating method capable of suppressing the reduction of a plating rate.SOLUTION: An electroless plating method comprises: pretreatment steps S02 to S12 including at least a washing step S12 of washing a plated material 2 formed with a plating resist 23,...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	NISHINO YUTA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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