ELECTROLESS PLATING METHOD, AND ELECTROLESS PLATING APPARATUS

PROBLEM TO BE SOLVED: To provide an electroless plating method capable of suppressing the reduction of a plating rate.SOLUTION: An electroless plating method comprises: pretreatment steps S02 to S12 including at least a washing step S12 of washing a plated material 2 formed with a plating resist 23, and a catalyst applying step S09 of applying a plating catalyst 451 to the plated material 2; and an electroless plating step S13 of immersing the plated material 2 in an electroless plating solution 511. Further comprised is a pre-immersion step S01 to be performed before the pretreatment steps S02 to S12 and for immersing the plated material 2 in an immersion solution 31 which is heated to a temperature of the electroless plating solution 511 in the electroless plating step S13 or higher. 【課題】めっき速度の低下を抑制することができる無電解めっき方法を提供する。【解決手段】めっきレジスト２３が形成された被めっき材２を洗浄する水洗工程Ｓ１２と、被めっき材２にめっき触媒４５１を付与する触媒付与工程Ｓ０９と、を少なくとも含む前処理工程Ｓ０２〜Ｓ１２と、被めっき材２を無電解めっき液５１１に浸漬する無電解めっき工程Ｓ１３と、を備えた無電解めっき方法であり、前処理工程Ｓ０２〜Ｓ１２の前に行われ、無電解めっき工程Ｓ１３における無電解めっき液５１１の温度以上の温度に加熱した浸漬液３１に被めっき材２を浸漬する予浸工程Ｓ０１をさらに備えている。【選択図】 図１