METHOD AND DEVICE FOR LASER PEENING

PROBLEM TO BE SOLVED: To provide a method and device for laser peening capable of implementing laser peening readily and reliably.SOLUTION: The method and device for laser peening radiates a second laser beam B with a second laser intensity stronger than a first laser intensity and a second pulse wi...

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Bibliographische Detailangaben
Hauptverfasser:	OKAMOTO AKIHIRO, HIEJIMA HIROYOSHI, OTA MICHIHARU, HAYASHI TAKAYUKI, OKAZAKI AKIRA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUSMETALS OR ALLOYS MACHINE TOOLS MAKING METAL MALLEABLE BY DECARBURISATION, TEMPERING OR OTHERTREATMENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY METALLURGY OF IRON MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method and device for laser peening capable of implementing laser peening readily and reliably.SOLUTION: The method and device for laser peening radiates a second laser beam B with a second laser intensity stronger than a first laser intensity and a second pulse width narrower than a first pulse width while radiating a first laser beam A with the first laser intensity and the first pulse width to a surface of an object 16 with, to a part to which the first laser beam A is radiated in the surface of the object. 【課題】簡便且つ確実にレーザピーニングを行い得るレーザピーニング方法及びレーザピーニング装置を提供する。【解決手段】第１のレーザ強度と第１のパルス幅とを有する第１のレーザ光Ａを物体１６の表面に照射しながら、第１のレーザ強度より強い第２のレーザ強度と、第１のパルス幅より狭い第２のパルス幅とを有する第２のレーザ光Ｂを物体の表面のうちの第１のレーザ光Ａが照射されている箇所に照射する。【選択図】図１