EVAPORATOR AND FILM DEPOSITION APPARATUS

PROBLEM TO BE SOLVED: To provide an evaporator which is free of burning and sticking on an evaporation pan in a film deposition device which generates vapor of an organic material and forms an organic thin film with the vapor, and the film deposition apparatus using the evaporator.SOLUTION: An evapo...

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Bibliographische Detailangaben
Hauptverfasser: ICHIHASHI YUJI, TANAKA KATSUNARI, HIRAOKA KENSUKE, KURATA TAKAOMI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an evaporator which is free of burning and sticking on an evaporation pan in a film deposition device which generates vapor of an organic material and forms an organic thin film with the vapor, and the film deposition apparatus using the evaporator.SOLUTION: An evaporation pan 23 is made of copper and has a flattening film 17 formed on a surface. While the evaporation pan 23 is screwed in a cap 21, a sealing material 62 is arranged between the evaporation pan 23 and an evaporation tank 22, and the cap 21 is screwed in a lower end of the evaporation tank 22. The flattening film 17 is exposed to an evaporation space 27 as the inner space of the evaporation tank 22, and copper forming the evaporation pan 23 and stainless steel forming the cap 21 are not exposed. The evaporation pan 23 is uniformly heated and the flattening film 17 has a flat surface, so neither burning nor sticking is caused. The flattening film 17 is an Ni coating. A heating device supplies an induction current to the evaporation tank 22 and cap 21 to heat the evaporation pan 23. 【課題】有機材料の蒸気を生成し、その蒸気により有機薄膜を形成する成膜装置において、蒸発皿上の焦げや付着が生じない蒸発装置とその蒸発装置を用いた成膜装置の提供。【解決手段】蒸発皿23を銅で構成し、表面に平坦化膜17を形成する。蒸発皿23をキャップ21にねじ込んだ状態で、蒸発皿23と蒸発槽22との間に密着部材62を配置し、キャップ21を蒸発槽22の下端にねじ込む。蒸発槽22の内部空間である蒸発空間27には、平坦化膜17が露出されており、蒸発皿23を構成する銅や、キャップ21を構成するステンレス鋼は露出されていない。蒸発皿23が均一に加熱され、平坦化膜17の表面が平坦なので、焦げや付着が生じない。平坦化膜17はNi被膜である。加熱装置は蒸発槽22とキャップ21に誘導電流を流して加熱を行う。【選択図】図3