THERMOSETTING TYPE RESIN COMPOSITION FOR ADHESIVELY BONDING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE SAME

PROBLEM TO BE SOLVED: To provide a thermosetting type resin composition for adhesively bonding a semiconductor that has low stress, good adhesive strength when heated after moisture absorption and good curability even in the atmosphere and to provide a semiconductor device using the thermosetting type resin composition for adhesively bonding a semiconductor that is excellent in solder reflow resistance.SOLUTION: The thermosetting type resin composition for adhesively bonding a semiconductor comprises as essential components (A) a bismaleimide resin which is liquid at an ordinary temperature and has an aliphatic hydrocarbon group in the main chain, (B) an allylated epoxy resin which is a polymer of an allylated bisphenol and an epichlorohydrin, (C) a curing agent, and (D) a filler and has a mass ratio (A)/(B) of the component (A) to the component (B) of 50/50 to 95/5. The semiconductor device is produced by using the thermosetting type resin composition. 【課題】低応力で吸湿後熱時接着強度が良好で、かつ、大気中においても硬化性が良好な半導体接着用熱硬化型樹脂組成物、及びそのような半導体接着用熱硬化型樹脂組成物を用いた耐半田リフロー性に優れた半導体装置を提供する。【解決手段】（Ａ）常温で液状であり、主鎖に脂肪族炭化水素基を有するビスマレイミド樹脂と、（Ｂ）アリル化ビスフェノールとエピクロルヒドリンとの重合物であるアリル化エポキシ樹脂と、（Ｃ）硬化剤と、（Ｄ）充填材と、を必須成分とし、（Ａ）成分と（Ｂ）成分との質量比（Ａ）／（Ｂ）が５０／５０〜９５／５である半導体接着用熱硬化型樹脂組成物及び該熱硬化型樹脂組成物を用いて得られた半導体装置。【選択図】なし