THERMAL HEAD AND THERMAL PRINTER INCLUDING THE SAME

PROBLEM TO BE SOLVED: To provide a thermal head that improves bond strength between a head base and a radiator.SOLUTION: A thermal head X1 includes: a substrate 7; a heating part 9 provided on the substrate 7; electrodes 17, 19 that are provided on the substrate 7 and electrically connected with the heating part 9; a radiator 1 that is arranged to be adjacent to the substrate 7 and has a through-hole 1b penetrating from a surface positioned at the substrate 7 side toward a surface of the opposite side; and a photocurable resin 2 for bonding the substrate 7 with the radiator 1, and the radiator 1 has an uneven portion 1c in the vicinity of the through-hole 1b on the surface positioned at the substrate 7 side. 【課題】 ヘッド基体と放熱体との接合強度が向上したサーマルヘッドを提供する。【解決手段】 サーマルヘッドＸ１は、基板７と、基板７上に設けられた発熱部９と、基板７上に設けられ、発熱部９と電気的に接続された電極１７，１９と、基板７と隣り合うように配置され、基板７側に位置する面から反対側の面に向けて貫通する貫通孔１ｂを有する放熱体１と、基板７と放熱体１とを接合する光硬化性樹脂２とを備え、放熱体１は、基板７側に位置する面の貫通孔１ｂの近傍に、凹凸１ｃが設けられている。【選択図】 図４