TEMPERATURE ESTIMATION DEVICE AND SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a temperature estimation device capable of improving estimation accuracy of temperature of a semiconductor element.SOLUTION: A first temperature detection unit 31 is provided at a first position separated from a semiconductor element 10. A second temperature detectio...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a temperature estimation device capable of improving estimation accuracy of temperature of a semiconductor element.SOLUTION: A first temperature detection unit 31 is provided at a first position separated from a semiconductor element 10. A second temperature detection unit 32 is provided at a second position different from the first position. In a storage unit 41, relationship between first temperature difference between element temperature of the semiconductor element 10 and first temperature at the first position and second temperature difference between the first temperature and the second temperature at the second position is recorded in advance. A temperature estimation unit 40 estimates the element temperature on the basis of: the first temperature detected by the first temperature detection unit 31; the second temperature detected by the second temperature detection unit 32; and the relationship stored in the storage unit 41. The second temperature detection unit 32 detects temperature of a cooling part 5.
【課題】半導体素子の温度の推定精度を向上できる温度推定装置を提供する。【解決手段】第1温度検出部31は半導体素子10から離れた第1位置に設けられる。第2温度検出部32は第1位置とは異なる第2位置に設けられる。記憶部41には、半導体素子10の素子温度と第1位置の第1温度との間の第1温度差と、第1温度と第2位置の第2温度との間の第2温度差との関係が予め記録される。温度推定部40は、第1温度検出部31が検出する第1温度と、第2温度検出部32が検出する第2温度と、記憶部41に記録された関係とに基づいて、素子温度を推定する。第2温度検出部32は冷却部5の温度を検出する。【選択図】図5 |
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