ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To improve the cooling efficiency of an air-cooled component in an electronic apparatus including an air-cooled component and a liquid-cooled component.SOLUTION: An air-cooled substrate 18, on which an air-cooled component is mounted, and a liquid-cooled substrate 20, on which...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	UMEMATSU MIMIO, HIRAI KEITA, KADOTANI YOSHIMI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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