ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To improve the cooling efficiency of an air-cooled component in an electronic apparatus including an air-cooled component and a liquid-cooled component.SOLUTION: An air-cooled substrate 18, on which an air-cooled component is mounted, and a liquid-cooled substrate 20, on which...

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Bibliographische Detailangaben
Hauptverfasser:	UMEMATSU MIMIO, HIRAI KEITA, KADOTANI YOSHIMI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Zusammenfassung:	PROBLEM TO BE SOLVED: To improve the cooling efficiency of an air-cooled component in an electronic apparatus including an air-cooled component and a liquid-cooled component.SOLUTION: An air-cooled substrate 18, on which an air-cooled component is mounted, and a liquid-cooled substrate 20, on which a liquid-cooled component is mounted, are separated from each other on a plane. A refrigerant supply member 43 for supplying a refrigerant which liquid-cools the liquid-cooled component to the liquid-cooled component is disposed on the liquid-cooled substrate 20. 【課題】空冷される空冷部品と、液冷される液冷部品とを備えた電子機器において、空冷部品の冷却効率を向上させる。【解決手段】空冷部品が搭載される空冷基板１８と、液冷部品が搭載される液冷基板２０とが、平面上で分離される。液冷基板２０上には、液冷部品を液冷する冷媒を液冷部品に供給する冷媒供給部材４３が配置される。【選択図】図１