SUBSTRATE PROCESSING APPARATUS

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can inhibit adhesion of a foreign substance to a substrate and improve uniformity of in-plane and out-of-plane temperature distributions.SOLUTION: A substrate processing apparatus for processing substrates which are arranged at...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KAWASAKI HIROMICHI, TANDO TAKUMI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PLASMA TECHNIQUE PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can inhibit adhesion of a foreign substance to a substrate and improve uniformity of in-plane and out-of-plane temperature distributions.SOLUTION: A substrate processing apparatus for processing substrates which are arranged at predetermined intervals on a heating stage having a heat source, the heating stage being arranged in a container to which a gas is supplied to the inside and which is evacuated comprises heat transfer reduction means which is provided inside the heating stage and on the center side corresponding to the substrate rear face, for reducing heat transfer more on the center side than on the outside. 【課題】基板への異物付着を抑制するとともに基板面内の内外の温度分布の均一化を改善することのできる基板処理装置を提供する。【解決手段】内部にガスが供給されるとともに減圧排気される容器内に配置され、加熱源を有する加熱ステージ上に所定間隔で配置して基板を処理する基板処理装置において、前記加熱ステージの内部であって前記基板裏面に対応する中央側に、該中央側の伝熱を外側のそれよりも少なくする伝熱降下手段を設ける。【選択図】図１