REGENERATION APPARATUS FOR TRIVALENT CHROMIUM PLATING SOLUTION, TRIVALENT CHROMIUM PLATING SYSTEM WITH THE REGENERATION APPARATUS, AND REGENERATION METHOD OF TRIVALENT CHROMIUM SOLUTION

PROBLEM TO BE SOLVED: To reduce concentration of hexavalent chromium ions generated in trivalent chromium plating liquid.SOLUTION: A trivalent chromium plating system comprises: a main tank 2 for applying trivalent chromium plating; a sub tank 3 which circulates trivalent chromium plating solution between the main tank 2 and the subtank and supplies the trivalent chromium plating solution to the main tank 2; and a regeneration apparatus 4 in which the trivalent chromium plating solution in the sub tank 3 is circulated. The trivalent chromium plating solution contains trivalent chromium ions and reducing agent, the regeneration apparatus 4 comprises a regeneration tank 5 to which the trivalent chromium plating solution after trivalent chromium plating is supplied, and a cooling tank 6 to which the trivalent chromium plating solution is supplied from the regeneration tank 5. Temperature of the regeneration tank 5 is set higher than trivalent chromium plating temperature, and temperature of the cooling tank 6 is set to the trivalent chromium plating temperature or higher and lower than the temperature of the regeneration tank 5. 【課題】３価クロムめっき液中に生成する６価クロムイオン濃度を減少させる。【解決手段】３価クロムめっきを施すための本槽２と、前記本槽２との間で３価クロムめっき液を循環して前記本槽２に３価クロムめっき液を供給するためのサブ槽３と、前記サブ槽３内の３価クロムめっき液が循環される再生装置４とを備え、前記３価クロムめっき液は３価クロムイオンと還元剤とを含有し、前記再生装置４は、３価クロムめっき後の３価クロムめっき液が供給される再生槽５と、該再生槽５から３価クロムめっき液が供給される冷却槽６とを備え、前記再生槽５の温度は、３価クロムめっき温度より高く設定され、前記冷却槽６の温度は、前記３価クロムめっき温度以上であって、前記再生槽５の温度より低く設定されている。【選択図】図１