ELEMENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide an element embedded printed circuit board capable of reducing warpage by disposing copper clad laminates (CCL) having the same coefficient of thermal expansion (CTE) on both surfaces of a build-up layer, and a method of manufacturing the element embedded printed circ...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM HAN, KIM JONG RIP
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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