LEAD FREE GLASS AND SEALING MATERIAL

PROBLEM TO BE SOLVED: To provide a sealing material having flowability capable of being sealed at 400°C or less for overcoming inefficient flowability which is important for sealing as an alternative material for avoiding use of expensive gold-tin solder and glass containing lead having effects on e...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HAMADA JUN, MIYAZAWA AKIMICHI
Format: Patent
Sprache:eng ; jpn
Schlagworte:
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