METAL FOIL WITH CARRIER FOIL, METAL FOIL WITH RESIN AND METAL FOIL CLAD LAMINATE

PROBLEM TO BE SOLVED: To provide: a metal foil with a carrier foil, eliminating an etching process for removing scattered copper and a roughened layer while maintaining direct laser workability; a metal foil with a resin; and a metal foil clad laminate.SOLUTION: There are provided: (1) a metal foil with a carrier foil, including a metal foil and a carrier foil that can be physically separated from the metal foil, and having a total thickness of the metal foil and the carrier foil of 12 μm or less; (2) a metal foil with a carrier foil that has a tensile strength of 600 MPa or more, in the metal foil with a carrier foil as mentioned in (1); (3) a metal foil with a carrier foil that has a thickness of 6-11 μm, in the metal foil with a carrier foil as mentioned in (2); (4) a metal foil with a resin including an adhesive resin disposed on a surface of a metal foil of one of the metal foils with a carrier foil as mentioned in (1)-(3), the surface being on a side opposite to a carrier foil; and (5) a metal foil clad laminate including an insulating resin and a conductor which are disposed on a side of a metal foil of one of the metal foils with a carrier foil as mentioned in (1)-(4), the side being opposite to a carrier foil. 【課題】ダイレクトレーザ加工性を維持しつつ、飛散した銅及び粗化層を除去するエッチング工程が不要なキャリア箔付き金属箔、樹脂付き金属箔及び金属箔張り積層体を提供することを目的とする。【解決手段】（１）金属箔と、この金属箔から物理的に剥離可能なキャリア箔とを有するキャリア箔付き金属箔であって、前記金属箔とキャリア箔とを合わせた厚みが１２μｍ以下であるキャリア箔付き金属箔。（２）上記において、キャリア箔が引張強さ６００ＭＰａ以上の銅箔であるキャリア箔付き金属箔。（３）上記において、キャリア箔の厚みが６〜１１μｍであるキャリア箔付き金属箔。（４）上記の何れかのキャリア箔付き金属箔の金属箔のキャリア箔と反対側の面に、接着用の樹脂を配置した樹脂付き金属箔。（５）上記の何れかのキャリア箔付き金属箔の金属箔のキャリア箔との反対側に絶縁樹脂と導体とを配置した金属箔張り積層体。【選択図】図１