ELECTRONIC EQUIPMENT
PROBLEM TO BE SOLVED: To provide electronic equipment capable of being miniaturized while keeping its appearance and rigidity of a housing proper.SOLUTION: A first exterior member 10 of electronic equipment 1 includes an inner layer part 11 that configures its inner surface, and an outer layer part...
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| Format: | Patent |
| Sprache: | eng ; jpn |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide electronic equipment capable of being miniaturized while keeping its appearance and rigidity of a housing proper.SOLUTION: A first exterior member 10 of electronic equipment 1 includes an inner layer part 11 that configures its inner surface, and an outer layer part 12 that configures its outer surface. The inner and outer layers 11 and 12 are formed by two-color-molding. Additionally, the inner surface of the first exterior member 10 is provided with areas A1 and A2 where the inner layer part 11 is not formed or where the inner layer part 11 is thin, and connectors 31A and 31C are arranged in the areas.
【課題】電子機器の外観及びハウジングの剛性を良好に保ちながら、電子機器の小型化を図ることができる電子機器を提供することにある。【解決手段】電子機器１の第１外装部材１０は、その内面を構成している内層部１１と、外面を構成している外層部１２とを有し、内層部１１と外層部１２とが二色成形で形成されている。また、第１外装部材１０の内面には、内層部１１が形成されていない又は内層部１１が薄い領域Ａ１，Ａ２が設けられ、この領域にコネクタ３１Ａ，３１Ｃが配置されている。【選択図】図３ |
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