OPTICAL TRANSMISSION MODULE
PROBLEM TO BE SOLVED: To provide an optical transmission module capable of suppressing deformation due to heat and deterioration in optical coupling efficiency.SOLUTION: An optical transmission module comprises: a main substrate 1 including a surface and a rear surface; an optical connector 5 includ...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide an optical transmission module capable of suppressing deformation due to heat and deterioration in optical coupling efficiency.SOLUTION: An optical transmission module comprises: a main substrate 1 including a surface and a rear surface; an optical connector 5 including a resin substrate 50; a first transparent substrate 2 arranged between the resin substrate 50 and the main substrate; a heat source element 3 arranged between the resin substrate 50 and the rear surface of the main substrate 1 and electrically connected to the main substrate 1; one or a plurality of wirings for electrically connecting the heat source element 3 and the main substrate 1 and for propagating the heat generated by the heat source element 3 and the first transparent substrate 2 to the main substrate 1; a first space 6 formed between the resin substrate 50 and the first transparent substrate 2 and for propagating the heat generated by the heat source element 3 and the first transparent substrate 2; and a second space 7 formed between the heat source element 3 and the rear surface of the main substrate 1 and for propagating the heat generated by the heat source element 3 and the first transparent substrate 2.
【課題】熱による変形や光結合効率の悪化を抑制できる光伝送モジュールを提供する。【解決手段】表面および裏面を有する本体基板1と、樹脂基板50を有する光コネクタ5と、樹脂基板50と本体基板との間に配置された第1の透明基板2と、樹脂基板50と本体基板1の裏面との間に配置され、本体基板1に電気的に接続された熱源素子3と、熱源素子3と本体基板1とを電気的に接続し、かつ熱源素子3および第1の透明基板2が発する熱を本体基板1に伝搬させる1または複数の配線と、樹脂基板50と第1の透明基板2との間に形成され、熱源素子3および第1の透明基板2が発する熱を伝搬させる第1の空間6と、熱源素子3と本体基板1の裏面との間に形成され、熱源素子3および第1の透明基板2が発する熱を伝搬させる第2の空間7とを備える。【選択図】図1 |
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