CIRCUIT MODULE

PROBLEM TO BE SOLVED: To provide a circuit module which has excellent shield effect and suitable for downsizing.SOLUTION: A circuit module according to the present embodiment comprises a circuit board, a mounting component, an encapsulation body and a shield. The circuit board has a mounting surface...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAKAMURA HIROSHI, KITAZAKI KENZO, MUGITANI HIDEJI, SARUWATARI TATSURO, SHIMAMURA MASAYA, SAJI TETSUO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!