METHOD FOR MANUFACTURING DISPLAY PANEL

PROBLEM TO BE SOLVED: To provide a method for manufacturing a display panel which enables, without using a laser in separating a polymer substrate or ultra-thin film glass substrate from a support substrate, easy implementation of a separation process, a reduced process cost, and separation of a lar...

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Bibliographische Detailangaben
Hauptverfasser:	JANG WOO JEONG, KIN YASUO, KIM HYOUNG-SHICK, YI GI-YON, KOO HYUN-WOO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for manufacturing a display panel which enables, without using a laser in separating a polymer substrate or ultra-thin film glass substrate from a support substrate, easy implementation of a separation process, a reduced process cost, and separation of a large area in a short time.SOLUTION: A method for manufacturing a display panel comprises: forming a release layer on a support substrate; forming a thin film substrate on the release layer; forming a pixel and an encapsulation member on the thin film substrate; and separating the support substrate from the thin film substrate. The release layer is formed by mixing siloxane and polyimide silane. 【課題】高分子基板又は超薄膜ガラス基板と支持基板とを分離させる際にレーザを使用せずとも、分離工程を容易に実施可能であり、工程費用を低くしつつ大面積を短時間で分離可能な、表示パネルの製造方法を提供すること。【解決手段】本発明に係る表示パネルの製造方法は、支持基板上に離型層を形成するステップと、前記離型層上に薄膜基板を形成するステップと、前記薄膜基板上に画素及び封止部材を形成するステップと、前記薄膜基板から前記支持基板を分離するステップと、を含み、前記離型層は、シロキサンとポリイミドシランとを混合して形成される。【選択図】図１