EFEM
PROBLEM TO BE SOLVED: To provide an EFEM which has a structure capable of preventing and suppressing an increase in a stroke amount of a wafer transfer robot in a height direction (increase in size of wafer transfer robot) and an increase in an installation area of the whole EFEM; also copes with an...
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| creator | TAKEMOTO YOSHIKATSU TAKAOKA SHUNJI NAKAMURA HIROAKI |
| description | PROBLEM TO BE SOLVED: To provide an EFEM which has a structure capable of preventing and suppressing an increase in a stroke amount of a wafer transfer robot in a height direction (increase in size of wafer transfer robot) and an increase in an installation area of the whole EFEM; also copes with an increase in a diameter of a wafer; and can handle a large number of wafers.SOLUTION: In an EFEM 1 which includes a wafer transfer chamber 3 having a wafer transfer robot 5 arranged in an internal space, and a load port 2 provided so as to be adjacent to a front face 32 of the wafer transfer chamber 3; and enables a semiconductor processing device M to be arranged on a rear face 33 of the wafer transfer chamber 3 so as to be adjacent to be the rear face 33, the EFEM 1 adopts such a structure that two buffer stations 4 capable of temporarily storing wafers W are provided side by side in forward and backward directions A, on both side faces 31 of the wafer transfer chamber 3, respectively.
【課題】ウェーハ搬送ロボットの高さ方向へのストローク量の増大化（ウェーハ搬送ロボットの大型化）及びＥＦＥＭ全体の設置面積の増大化を防止・抑制可能な構成でありながら、ウェーハの大径化にも対応しつつ多数枚のウェーハを取り扱うことが可能なＥＦＥＭを提供する。【解決手段】ウェーハ搬送ロボット５を内部空間に配置したウェーハ搬送室３と、ウェーハ搬送室３の前面３２に隣接して設けたロードポート２と、ウェーハ搬送室３の後面３３に半導体処理装置Ｍを隣接して配置可能なＥＦＥＭ１において、ウェーハＷを一時的に収容可能なバッファステーション４をウェーハ搬送室３の両側面３１にそれぞれ２台ずつ前後方向Ａに併設した構成を採用した。【選択図】図１ |
| format | Patent |
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【課題】ウェーハ搬送ロボットの高さ方向へのストローク量の増大化（ウェーハ搬送ロボットの大型化）及びＥＦＥＭ全体の設置面積の増大化を防止・抑制可能な構成でありながら、ウェーハの大径化にも対応しつつ多数枚のウェーハを取り扱うことが可能なＥＦＥＭを提供する。【解決手段】ウェーハ搬送ロボット５を内部空間に配置したウェーハ搬送室３と、ウェーハ搬送室３の前面３２に隣接して設けたロードポート２と、ウェーハ搬送室３の後面３３に半導体処理装置Ｍを隣接して配置可能なＥＦＥＭ１において、ウェーハＷを一時的に収容可能なバッファステーション４をウェーハ搬送室３の両側面３１にそれぞれ２台ずつ前後方向Ａに併設した構成を採用した。【選択図】図１</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150319&DB=EPODOC&CC=JP&NR=2015053413A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150319&DB=EPODOC&CC=JP&NR=2015053413A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKEMOTO YOSHIKATSU</creatorcontrib><creatorcontrib>TAKAOKA SHUNJI</creatorcontrib><creatorcontrib>NAKAMURA HIROAKI</creatorcontrib><title>EFEM</title><description>PROBLEM TO BE SOLVED: To provide an EFEM which has a structure capable of preventing and suppressing an increase in a stroke amount of a wafer transfer robot in a height direction (increase in size of wafer transfer robot) and an increase in an installation area of the whole EFEM; also copes with an increase in a diameter of a wafer; and can handle a large number of wafers.SOLUTION: In an EFEM 1 which includes a wafer transfer chamber 3 having a wafer transfer robot 5 arranged in an internal space, and a load port 2 provided so as to be adjacent to a front face 32 of the wafer transfer chamber 3; and enables a semiconductor processing device M to be arranged on a rear face 33 of the wafer transfer chamber 3 so as to be adjacent to be the rear face 33, the EFEM 1 adopts such a structure that two buffer stations 4 capable of temporarily storing wafers W are provided side by side in forward and backward directions A, on both side faces 31 of the wafer transfer chamber 3, respectively.
【課題】ウェーハ搬送ロボットの高さ方向へのストローク量の増大化（ウェーハ搬送ロボットの大型化）及びＥＦＥＭ全体の設置面積の増大化を防止・抑制可能な構成でありながら、ウェーハの大径化にも対応しつつ多数枚のウェーハを取り扱うことが可能なＥＦＥＭを提供する。【解決手段】ウェーハ搬送ロボット５を内部空間に配置したウェーハ搬送室３と、ウェーハ搬送室３の前面３２に隣接して設けたロードポート２と、ウェーハ搬送室３の後面３３に半導体処理装置Ｍを隣接して配置可能なＥＦＥＭ１において、ウェーハＷを一時的に収容可能なバッファステーション４をウェーハ搬送室３の両側面３１にそれぞれ２台ずつ前後方向Ａに併設した構成を採用した。【選択図】図１</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZGBxdXP15WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgaGpgamxiaGxo7GRCkCAN7JGmw</recordid><startdate>20150319</startdate><enddate>20150319</enddate><creator>TAKEMOTO YOSHIKATSU</creator><creator>TAKAOKA SHUNJI</creator><creator>NAKAMURA HIROAKI</creator><scope>EVB</scope></search><sort><creationdate>20150319</creationdate><title>EFEM</title><author>TAKEMOTO YOSHIKATSU ; TAKAOKA SHUNJI ; NAKAMURA HIROAKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2015053413A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKEMOTO YOSHIKATSU</creatorcontrib><creatorcontrib>TAKAOKA SHUNJI</creatorcontrib><creatorcontrib>NAKAMURA HIROAKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKEMOTO YOSHIKATSU</au><au>TAKAOKA SHUNJI</au><au>NAKAMURA HIROAKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EFEM</title><date>2015-03-19</date><risdate>2015</risdate><abstract>PROBLEM TO BE SOLVED: To provide an EFEM which has a structure capable of preventing and suppressing an increase in a stroke amount of a wafer transfer robot in a height direction (increase in size of wafer transfer robot) and an increase in an installation area of the whole EFEM; also copes with an increase in a diameter of a wafer; and can handle a large number of wafers.SOLUTION: In an EFEM 1 which includes a wafer transfer chamber 3 having a wafer transfer robot 5 arranged in an internal space, and a load port 2 provided so as to be adjacent to a front face 32 of the wafer transfer chamber 3; and enables a semiconductor processing device M to be arranged on a rear face 33 of the wafer transfer chamber 3 so as to be adjacent to be the rear face 33, the EFEM 1 adopts such a structure that two buffer stations 4 capable of temporarily storing wafers W are provided side by side in forward and backward directions A, on both side faces 31 of the wafer transfer chamber 3, respectively.
【課題】ウェーハ搬送ロボットの高さ方向へのストローク量の増大化（ウェーハ搬送ロボットの大型化）及びＥＦＥＭ全体の設置面積の増大化を防止・抑制可能な構成でありながら、ウェーハの大径化にも対応しつつ多数枚のウェーハを取り扱うことが可能なＥＦＥＭを提供する。【解決手段】ウェーハ搬送ロボット５を内部空間に配置したウェーハ搬送室３と、ウェーハ搬送室３の前面３２に隣接して設けたロードポート２と、ウェーハ搬送室３の後面３３に半導体処理装置Ｍを隣接して配置可能なＥＦＥＭ１において、ウェーハＷを一時的に収容可能なバッファステーション４をウェーハ搬送室３の両側面３１にそれぞれ２台ずつ前後方向Ａに併設した構成を採用した。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | EFEM |
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