EFEM

PROBLEM TO BE SOLVED: To provide an EFEM which has a structure capable of preventing and suppressing an increase in a stroke amount of a wafer transfer robot in a height direction (increase in size of wafer transfer robot) and an increase in an installation area of the whole EFEM; also copes with an...

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Bibliographische Detailangaben
Hauptverfasser: TAKEMOTO YOSHIKATSU, TAKAOKA SHUNJI, NAKAMURA HIROAKI
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an EFEM which has a structure capable of preventing and suppressing an increase in a stroke amount of a wafer transfer robot in a height direction (increase in size of wafer transfer robot) and an increase in an installation area of the whole EFEM; also copes with an increase in a diameter of a wafer; and can handle a large number of wafers.SOLUTION: In an EFEM 1 which includes a wafer transfer chamber 3 having a wafer transfer robot 5 arranged in an internal space, and a load port 2 provided so as to be adjacent to a front face 32 of the wafer transfer chamber 3; and enables a semiconductor processing device M to be arranged on a rear face 33 of the wafer transfer chamber 3 so as to be adjacent to be the rear face 33, the EFEM 1 adopts such a structure that two buffer stations 4 capable of temporarily storing wafers W are provided side by side in forward and backward directions A, on both side faces 31 of the wafer transfer chamber 3, respectively. 【課題】ウェーハ搬送ロボットの高さ方向へのストローク量の増大化(ウェーハ搬送ロボットの大型化)及びEFEM全体の設置面積の増大化を防止・抑制可能な構成でありながら、ウェーハの大径化にも対応しつつ多数枚のウェーハを取り扱うことが可能なEFEMを提供する。【解決手段】ウェーハ搬送ロボット5を内部空間に配置したウェーハ搬送室3と、ウェーハ搬送室3の前面32に隣接して設けたロードポート2と、ウェーハ搬送室3の後面33に半導体処理装置Mを隣接して配置可能なEFEM1において、ウェーハWを一時的に収容可能なバッファステーション4をウェーハ搬送室3の両側面31にそれぞれ2台ずつ前後方向Aに併設した構成を採用した。【選択図】図1