METHOD OF MEASURING SURFACE ROUGHNESS OF POLISHING PAD

PROBLEM TO BE SOLVED: To provide a method of measuring the surface roughness of a polishing pad with which a surface roughness index of the polishing pad can be measured, which indicates strong relevance with polishing performance.SOLUTION: A method of measuring the surface roughness of a polishing...

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Bibliographische Detailangaben
1. Verfasser:	MATSUO NAONORI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PERFORMING OPERATIONS PHYSICS POLISHING SEMICONDUCTOR DEVICES TESTING TRANSPORTING
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