METHOD OF MEASURING SURFACE ROUGHNESS OF POLISHING PAD

PROBLEM TO BE SOLVED: To provide a method of measuring the surface roughness of a polishing pad with which a surface roughness index of the polishing pad can be measured, which indicates strong relevance with polishing performance.SOLUTION: A method of measuring the surface roughness of a polishing...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	MATSUO NAONORI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PERFORMING OPERATIONS PHYSICS POLISHING SEMICONDUCTOR DEVICES TESTING TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of measuring the surface roughness of a polishing pad with which a surface roughness index of the polishing pad can be measured, which indicates strong relevance with polishing performance.SOLUTION: A method of measuring the surface roughness of a polishing pad 2 includes the steps of: acquiring an image of the surface of the polishing pad by using a laser microscope 30; selecting only areas higher than the average height from the acquired image; and calculating the surface roughness only from the selected areas. 【課題】研磨性能と強い関連性を示す研磨パッドの表面粗さ指標を測定することができる研磨パッドの表面粗さ測定方法を提供する。【解決手段】研磨パッド２の表面粗さの測定方法であって、レーザー顕微鏡３０を用いて研磨パッド表面の画像を取得する工程と、取得した画像内から平均高さより高さの大きな領域のみを選択する工程と、選択された領域のみから表面粗さを算出する工程と、からなる。【選択図】図２