WAFER ADSORPTION DEVICE
PROBLEM TO BE SOLVED: To provide a wafer adsorption device capable of adsorbing and fixing a flexible wafer so as not to generate floating.SOLUTION: A wafer adsorption device 2 comprises a stage part 11 on which a wafer W is mounted, and adsorbs and holds the wafer W. The stage part 11 is formed by...
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| Format: | Patent |
| Sprache: | eng ; jpn |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a wafer adsorption device capable of adsorbing and fixing a flexible wafer so as not to generate floating.SOLUTION: A wafer adsorption device 2 comprises a stage part 11 on which a wafer W is mounted, and adsorbs and holds the wafer W. The stage part 11 is formed by joining a plurality of adsorption blocks 15 each formed from a porous material. A joint part 16 that is a portion where two adsorption blocks 15a and 15b are joined, includes: a bonding part 19 formed from an adhesive for bonding composition planes 17a and 17b; and pore filling parts 18a and 18b which are positioned adjacently with the bonding part 19 and closer to a center between both the adsorption blocks 15 relatively to the bonding part 19, and formed from a pore filling agent for filling pores of the composition planes 17a and 17b.
【課題】可撓性の基材を浮きが生じるようなことなく吸着固定することのできる基材吸着装置を提供する。【解決手段】基材Ｗを載置するステージ部１１を備え、基材Ｗを吸着保持する基材吸着装置２であり、ステージ部１１は、多孔質材からなる複数の吸着ブロック１５が接合されて形成され、二つの吸着ブロック１５ａおよび吸着ブロック１５ｂが接合されている部分である接合部１６は、接合面１７ａおよび接合面１７ｂを接着する接着剤によって形成される接着部１９と、接着部１９と隣接して接着部１９に対して両吸着ブロック１５の中心側に位置し、接合面１７ａおよび接合面１７ｂを孔埋めする孔埋め剤によって形成される孔埋め部１８ａおよび孔埋め部１８ｂを有する。【選択図】図３ |
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