PACKAGE

PROBLEM TO BE SOLVED: To provide a package which can be easily downsized and reduced in height while surely preventing, even when a metal layer formed in a peripheral part of a front face of a package body and a pair of electrode pads formed on the front face surrounded by the metal layer become closer to each other, the electrode pads and the metal layer from being short-circuited even via a brazing material.SOLUTION: A package 1a comprises: a package body 2 which is formed of a ceramic (insulation material) (c) and has a front face 3 and a rear face 4 having a rectangular shape in a plan view; a metal layer 6 which is formed along the peripheral part on the front face 3 of the package body 2 and has a rectangular-frame shape in a plan view; a metal frame 8 which is joined on a surface of the metal layer 6 via a brazing material 7 and has a rectangular-frame shape in a plan view; and a pair of electrode pads 9 which is formed on the front face 3 of the package body 2 surrounded by the metal layer 6 for packaging a crystal oscillator. In at least a part of the front face 3 of the package body 2 held between the metal layer 6 and the pair of electrode pads 9, a projecting part 10 that is formed of a ceramic (insulation material) is projectingly provided. 【課題】パッケージ本体の表面の周辺部に形成した金属層と、該金属層に囲まれた上記表面に形成された一対の電極パッドとが互いに接近しても、該電極パッドと上記金属層とがロウ材を介しても確実にショートせず、小型化および低背化が容易なパッケージを提供する。【解決手段】セラミック（絶縁材）ｃからなり、平面視が矩形の表面３および裏面４を有するパッケージ本体２と、該パッケージ本体２の表面３における周辺部に沿って形成された平面視が矩形枠状の金属層６と、該金属層６の表面上にロウ材７を介して接合された平面視が矩形枠状の金属枠８と、上記金属層６に囲まれたパッケージ本体２の表面３に形成され、且つ水晶振動子を実装するための一対の電極パッド９と、を備えたパッケージ１ａであって、上記金属層６と一対の電極パッド９とに挟まれたパッケージ本体２の表面３の少なくとも一部には、セラミック（絶縁材）からなる凸条部１０が突設されている、パッケージ１ａ。【選択図】 図２