PHOTOCURABLE RESIN COMPOSITION, CURED PRODUCT OF THE SAME AND PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide: a photocurable resin composition which is suppressed in the generation of outgas; a cured product which is obtained by curing the same; and a printed wiring board which is provided with the same.SOLUTION: A photocurable resin composition contains a carboxyl group-co...

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Bibliographische Detailangaben
Hauptverfasser:	KONDO SHINOBU, MATSUMOTO SHIGERU, NORIKOSHI AKIO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide: a photocurable resin composition which is suppressed in the generation of outgas; a cured product which is obtained by curing the same; and a printed wiring board which is provided with the same.SOLUTION: A photocurable resin composition contains a carboxyl group-containing resin, a compound that has two or more ethylenically unsaturated groups in each molecule, and a photopolymerization initiator that has a structure represented by general formula (II) at both terminals of polyethylene glycol. 【課題】アウトガスの発生が抑制された光硬化性樹脂組成物、それを硬化してなる硬化物、および、それを備えるプリント配線板の提供。【解決手段】カルボキシル基含有樹脂、分子中に２個以上のエチレン性不飽和基を有する化合物、および、ポリエチレングリコールの両末端に下記一般式（ＩＩ）で表される構造を有する光重合開始剤、を含有する光硬化性樹脂組成物。【選択図】なし