ADHEREND FIXING METHOD, AND ADHEREND FIXING AND PEELING METHOD

PROBLEM TO BE SOLVED: To provide an adherend fixing method, and an adherend fixing and peeling method.SOLUTION: An adherend fixing method comprises a sticking step of sticking, to a first adherend, a second adherend through an adhesive layer comprising polyamide adhesive, and a heating step of heati...

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Bibliographische Detailangaben
Hauptverfasser:	YAMAGUCHI MASATOSHI, MASUDA KATSUYUKI, FUKUYAMA TAKEHIRO, YAMAMOTO KAZUNORI, SHINADA EIITSU, YANAGIDA HIROTAKA, OKOSHI SHOJI, OYAMA YASUSHI, KATAYOSE MITSUO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an adherend fixing method, and an adherend fixing and peeling method.SOLUTION: An adherend fixing method comprises a sticking step of sticking, to a first adherend, a second adherend through an adhesive layer comprising polyamide adhesive, and a heating step of heating the first adherend and the second adherend, under the condition that the temperature of the adhesive layer becomes 200°C or more. 【課題】被着体の固定方法、並びに、被着体の固定及び剥離方法を提供することを目的とする。【解決手段】第一の被着体に、ポリアミド粘着剤を含有する粘着層を介して、第二の被着体を貼付する貼付工程と、前記粘着層の温度が２００℃以上となる条件下で、前記第一の被着体及び前記第二の被着体を加熱する加熱工程と、を備える、被着体の固定方法。【選択図】なし