STRUCTURE AND METHOD FOR CONNECTING TERMINAL BOARD TO FLEXIBLE CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a structure and a method for connecting a terminal board to a flexible circuit board in which connection between a conductive pattern formed on the flexible circuit board and the terminal board can be surely performed.SOLUTION: Disclosed is a structure for connecting...

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Bibliographische Detailangaben
Hauptverfasser: HIRAYAMA YUYA, MITSUI KOJI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a structure and a method for connecting a terminal board to a flexible circuit board in which connection between a conductive pattern formed on the flexible circuit board and the terminal board can be surely performed.SOLUTION: Disclosed is a structure for connecting a terminal board to a flexible circuit board in which, after adhering and integrating a conductive pattern 17 formed on the flexible circuit board 10 to/with the terminal board 20 using a low-temperature solder layer 50, a molding 30 is molded so as to cover the upper and lower sides of an adhered portion between the conductive pattern 17 and the terminal board 20. As a result, electrical/mechanical connection between the conductive pattern 17 and the terminal board 20 can be firmly performed. 【課題】フレキシブル回路基板上に形成した導電パターンと端子板間の接続を確実に行えるフレキシブル回路基板への端子板接続構造及び方法を提供すること。【解決手段】フレキシブル回路基板10に形成した導電パターン17と端子板20間を、低温半田層50によって接着・一体化した上で、導電パターン17と端子板20の接着部分の上下を覆うように成形品30を成形してなるフレキシブル回路基板への端子板接続構造である。これによって導電パターン17と端子板20間の電気的・機械的接続を強固に行うことができる。【選択図】図2