ELECTRONIC COMPONENT SEPARATION APPARATUS OF PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide an improved electronic component separation apparatus which uses swirling airflow generated in a cylindrical heating vessel in a component separation process by a centrifugal separation method in a printed circuit board, and is capable of surely discharging and recov...

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Hauptverfasser: MARUTA YURI, FUJITA MITSURU
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an improved electronic component separation apparatus which uses swirling airflow generated in a cylindrical heating vessel in a component separation process by a centrifugal separation method in a printed circuit board, and is capable of surely discharging and recovering electronic components and a circuit board separated from a printed circuit board to be processed from a heating vessel.SOLUTION: A rotary holding mechanism that holds a printed circuit board to be processed is provided for a cylindrical heating vessel 21 mounted on a support frame 10, and a separated components recovery box 50 is provided from a component outlet port 21a open on a peripheral wall of the vessel while extending in a tangential direction continuously from the outlet port. At the point where superheated steam is supplied to the heating vessel 21 and heated until a brazing material of the printed circuit board melts, the rotary holding mechanism is driven to rotate to centrifugally separate electronic components from the printed circuit board, and the electronic components and the circuit board are driven to swirl by swirling airflow generated in the heating vessel with the rotation drive of the rotary holding mechanism, and discharged and recovered from an outlet port of the heating vessel 21 to the separated components recovery box 50. 【課題】遠心分離方式によるプリント回路板の部品分離工程で円筒形の加熱容器内に生起する旋回気流を利用し、被処理のプリント回路板から分離した電子部品、回路基板を加熱容器から確実に排出、回収できるように改良した電子部品分離装置を提供する。【解決手段】支持架台10に搭載した円筒形の加熱容器21に被処理のプリント回路板を保持する回転保持機構、および該容器の周壁に開口した部品取出口21aからこれに連ねて接線方向に延長して分離部品回収箱50を設け、この加熱容器21に過熱水蒸気を供給してプリント回路板のろう材が溶融するまで加熱したところで、前記回転保持機構を回転駆動してプリント回路板から電子部品を遠心分離させるとともに、この回転保持機構の回転駆動に伴って加熱容器内に生起した旋回気流により電子部品、および回路基板を旋回駆動させ、加熱容器21の取出口から分離部品回収箱50に排出して回収する。【選択図】図1