SOLDERING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a soldering method via a nickel plating layer enabling a void generation rate to be reduced, and to provide a method of manufacturing a semiconductor device by using the soldering method.SOLUTION: By preliminarily heating a copper base plate 1 having a nickel plating...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	ISO AKIYOSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a soldering method via a nickel plating layer enabling a void generation rate to be reduced, and to provide a method of manufacturing a semiconductor device by using the soldering method.SOLUTION: By preliminarily heating a copper base plate 1 having a nickel plating layer 2 in an inert gas atmosphere in a temperature range of 300-400°C, the void generation rate can be reduced in soldering between the copper base plate and an insulation circuit board 8. 【課題】ボイド発生率を低減できるニッケルめっき層を介したはんだ付け方法およびこのはんだ付け方法を用いた半導体装置の製造方法を提供する。【解決手段】ニッケルめっき層２を有する銅ベース板１を予め、不活性ガス雰囲気中で３００℃〜４００℃の温度範囲で加熱することで、銅ベース板と絶縁回路基板８のはんだ付けでボイド発生率を低減することができる。【選択図】図５