POLISHING CARRIER, POLISHING LIQUID COMPOSITION, AND POLISHING METHOD

PROBLEM TO BE SOLVED: To provide a carrier for polishing to obtain a polishing liquid composition capable of providing a sufficient polishing rate and surface smoothness, and showing little temporal deterioration of a polishing rate and surface smoothness; a polishing liquid composition using the sa...

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Bibliographische Detailangaben
1. Verfasser:	OKIMOTO YOSHIO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVES CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS PHYSICS POLISHES POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a carrier for polishing to obtain a polishing liquid composition capable of providing a sufficient polishing rate and surface smoothness, and showing little temporal deterioration of a polishing rate and surface smoothness; a polishing liquid composition using the same; and a method of polishing a substrate using the same.SOLUTION: Provided is a polishing carrier having a polymeric silicon compound, which has a weight average molecular weight of 500 to 1,000,000 and has amide groups and carboxyl groups in the structure, supported on a carrier. 【課題】本発明の目的は、十分な研磨速度及び平坦性が得られ、研磨速度や平坦性の経時劣化が少ない研磨液組成物を得るための研磨用担持体、それを用いた研磨液組成物、及びそれを用いた基材の研磨方法を提供することにある。【解決手段】本発明は、被担持体に、構造中にアミド基及びカルボキシル基を有する重量平均分子量５００〜１，０００，０００の高分子ケイ素化合物を担持した研磨用担持体を提供するものである。【選択図】なし