CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
PROBLEM TO BE SOLVED: To provide conductive particles capable of enhancing conduction reliability when electrically connecting electrodes.SOLUTION: Conductive particles 1 according to the present invention each include a base material particle 2 and a conductive layer 3 disposed on the surface of th...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide conductive particles capable of enhancing conduction reliability when electrically connecting electrodes.SOLUTION: Conductive particles 1 according to the present invention each include a base material particle 2 and a conductive layer 3 disposed on the surface of the base material particle 2. The base material particle 2 has a compressive elastic modulus of 1,000 N/mmor more when compressed by 10%. The conductive layer 3 has a palladium layer on the outer surface side. The content of palladium is 99.9 wt.% or more in 100 wt.% of the palladium layer.
【課題】電極間を電気的に接続した場合に、導通信頼性を高めることができる導電性粒子を提供する。【解決手段】本発明に係る導電性粒子1は、基材粒子2と、基材粒子2の表面上に配置された導電層3とを備え、基材粒子2を10%圧縮したときの圧縮弾性率が1000N/mm2以上であり、導電層3が外表面側にパラジウム層を有し、パラジウム層100重量%中、パラジウムの含有量が99.9重量%以上である。【選択図】図1 |
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